The 3D AOI TR7700SIII is easy to operate. Large scale recycling of AOI/SPI.

Large scale recycling of AOI/SPI.

The TRI TR7700 SIII 3D adopts a high-speed hybrid PCB inspection method, combined with optical and blue laser 3D real contour measurement, to achieve maximum coverage for automated detection of defects. Combined with excellent software solutions and third-generation intelligent hardware platforms, it can provide stable and powerful 3D solder dot and component defect detection, with high detection coverage and easy programming advantages.