1、 Improve detection accuracy

Traditional 2D AOI equipment is difficult or even impossible to detect quality issues such as high and low component shadow pin type IC warping, flattened chip floating height, wrong parts with the same surface size, and false soldering when detecting the manufacturing quality of electronic circuit boards and assemblies. Through its imaging principles and algorithms, 3D AOI equipment can easily detect these quality issues, thereby improving the accuracy of detection.

2、 Responding to more precise manufacturing demands

With the development of electronic products such as smartphones and wearable devices, PCB motherboards are becoming increasingly precise, electronic components are becoming smaller (such as 0201, 01005, etc.), and more and more ICs are being applied (such as OFN SOPBGA, etc.). These changes make the traditional 2DAO imaging technology ineffective in detecting precision and unable to meet more stringent manufacturing requirements. 3D AOI equipment can meet more precise manufacturing needs and meet the strict requirements of end brand manufacturers for upstream suppliers' manufacturing and testing technology.

3、 Dealing with complex detection environments

Traditional 2D AOI equipment cannot function properly in complex detection environments, such as insufficient light and surface reflection of objects. And 3D AOI equipment, through its unique technology and algorithms, can cope with these complex detection environments, ensuring the accuracy and stability of detection.

The use of 3D AOI equipment can improve detection accuracy, meet more precise manufacturing requirements, and cope with complex detection environments.