Release time ：2023-10-24
TR7700 SIII 3D adopts a high-speed hybrid PCB detection method, combined with optical and blue laser 3D true contour measurement, to achieve maximum coverage for automated detection of defects. Combining excellent software solutions and third-generation intelligent hardware platforms, it can provide stable and powerful 3D tin point and component defect detection, with high detection coverage and easy programming advantages.
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