TRI's ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
The TRI equipment sold by our company are all second-hand equipment with good condition and stable performance.
The service engineers all have more than 5 years of work experience in the original factory. Before shipment, we will conduct an overall inspection and demo 1-2 working days before shipping.
Rental equipment, service maintenance, upgrade and warranty are all handled by our engineering staff;
The whole machine is guaranteed for 3 months, and some important parts are guaranteed for 1 year. If the warranty is out, our company has sufficient spare parts and can provide emergency repairs.
Buying/Rental Hotline: 13776054406 (mobile phone/WeChat)
Buying/Rental Hotline: 13382150663 (mobile phone/WeChat)
Featrures
• High speed 2D+3D detection, capable of detecting up to 01005 components
• Has the advantages of high detection coverage and easy programming
• Real 3D contour measurement technology using dual laser units
• Intelligent and fast programming interface with automated database and offline programming functions
Specifications
Optical System | |
Imaging Method | Dynamic Imaging with true 3D profile measurement |
Top Camera | 4 Mpix |
Angle Camera | N/A |
Imaging Resolution | 10 µm, 15 µm (factory setting) |
Lighting | Multi-phase RGB+W LED |
3D Technology | Single/Dual 3D laser sensors |
Max. 3D Range | 20 mm |
Inspection Performance | |
Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec |
4 Mpix@ 15 µm 2D: 120 cm²/sec | |
4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* | |
4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* | |
* Depending on board size and laser resolution | |
Motion Table & Control | |
X-Axis Control | Ballscrew + AC-servo controller |
Y-Axis Control | Ballscrew + AC-servo controller |
Z-Axis Control | N/A |
X-Y Axis Resolution | 1 µm |
Board Handling | |
Max PCB Size | TR7700 SIII 3D: 510 x 460 mm |
TR7700L SIII 3D: 660 x 460 mm | |
TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane | |
PCB Thickness | 0.6-5 mm |
Max PCB Weight | 3 kg |
Top Clearance | 25 mm |
Bottom Clearance | 40 mm |
Edge Clearance | 3 mm [5 mm optional] |
Conveyor | Inline |
Height: 880 – 920 mm | |
* SMEMA Compatible | |
Inspection Functions | |
Component | Missing |
Tombstoning | |
Billboarding | |
Polarity | |
Rotation | |
Shift | |
Wrong Marking (OCV) | |
Defective | |
Upside Down | |
Extra Component | |
Foreign Material | |
Lifted Component | |
Solder | Excess Solder |
Insufficient Solder | |
Bridging | |
Through-hole Pins | |
Lifted Lead | |
Golden Finger | |
Scratch/Contamination | |
Dimensions | |
WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm |
TR7700L SIII 3D: 1300 x 1650 x 1650 mm | |
TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm | |
Note: not including signal tower, signal tower height 520 mm | |
Weight | TR7700 SIII 3D: 1030 kg |
TR7700L SIII 3D: 1250 kg | |
TR7700 SIII 3D DL: 1150 kg |