Medieval equipment

AOI/SPI/ICT used equipment supplier

TR7007 SII Plus 3D Solder Paste Inspection (SPI)

Years:2017
Category:SPI
Brand:TRI
Model:TR7007 SII Plus
Area:Kunshan
Warranty:Guaranteed for 3 months
Specializing in SMT testing equipment for 16 years
AOI/SPI/ICT used equipment supplier
Product Description

With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI's quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.


The TRI equipment sold by our company are all second-hand equipment with good condition and stable performance. 

The service engineers all have more than 5 years of work experience in the original factory. Before shipment, we will conduct an overall inspection and demo 1-2 working days before shipping.

Rental equipment, service maintenance, upgrade and warranty are all handled by our engineering staff;

The whole machine is guaranteed for 3 months, and some important parts are guaranteed for 1 year. If the warranty is out, our company has sufficient spare parts and can provide emergency repairs.


Buying/Rental Hotline: 13776054406 (mobile phone/WeChat)


Featrures

• Industry leading inspection speed up to 200 cm2/sec @ 15 µm

• High resolution detectable 0201mm/01005mm micro component solder paste

• Linear motor design provides precise vibration free detection

• Advanced SPC functions for production quality monitoring and evaluation


Specifications


Optical System
Imaging MethodDynamic Imaging
Camera4 Mpix
Imaging Resolution10 µm or 15 µm (factory setting)
LightingRGB LED
3D Technology2-way Fringe Pattern
Field of View4 Mpix@ 10 µm: 20 x 20 mm
4 Mpix@ 15 µm: 30 x 30 mm


Inspection Performance
Imaging Speed4 Mpix@ 10 µm: 90 cm²/sec
4 Mpix@ 15 µm: 200 cm²/sec
Height Resolution0.4 µm
Max. Solder Height@ 10 µm: 600 µm

@ 15 µm: 550 µm


Motion Table & Control
X-Axis ControlLinear Motor and linear scale with DSP-based controller
Y-Axis ControlBallscrew + AC-servo controller
Z-Axis ControlBallscrew + AC-servo controller
X-Y Axis Resolution0.5 µm
Z-Axis Resolution1 µm


Board Handling
Max PCB SizeTR7007 SII Plus: 510 x 460 mm
TR7007L SII Plus: 660 x 610 mm
TR7007 SII Plus DL: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane
PCB Thickness0.6-5 mm
Max PCB Weight3 kg
Top Clearance25 mm
Bottom Clearance40 mm
Edge Clearance3 mm
Conveyor Height880 – 920 mm

* SMEMA Compatible


nspection Functions
DefectsInsufficient Paste
Excessive Paste
Shape Deformity
Missing Paste & Bridging
MeasurementHeight
Area
Volume
Offset


Dimensions
WxDxHTR7007 SII Plus: 1100 x 1570 x 1550
TR7007L SII Plus: 1300 x 1610 x 1560 mm
TR7007 SII Plus DL: 1100 x 1770 x 1560 mm
Note: not including signal tower, signal tower height 520 mm
WeightTR7007 SII Plus: 950 kg
TR7007L SII Plus: 1250 kg
TR7007 SII Plus DL: 1100 kg