Specializing in SMT testing equipment for 16 years
AOI/SPI/ICT used equipment supplier
TR7700Q 3D AOI has digital four-way stripe light projection technology, combined with the most innovative 2D+3D inspection technology, setting off a new revolution in the field of assembly circuit board inspection. The all-round 3D digital stripe light technology covers a wide range of detection, and has excellent accuracy to present minimal coplanar defects and solder joint problems. TRI's 3D tin spot and tin climbing inspection conforms to IPC standards to ensure the quality of tin climbing. By checking the height and volume of tin climbing, TR7700Q 3D AOI can detect defects such as less tin, lack of tin, and empty soldering.
The TRI equipment sold by our company are all second-hand equipment with good condition and stable performance.
The service engineers all have more than 5 years of work experience in the original factory. Before shipment, we will conduct an overall inspection and demo 1-2 working days before shipping.
Rental equipment, service maintenance, upgrade and warranty are all handled by our engineering staff;
The whole machine is guaranteed for 3 months, and some important parts are guaranteed for 1 year. If the warranty is out, our company has sufficient spare parts and can provide emergency repairs.
Buying/Rental Hotline: 13776054406 (mobile phone/WeChat)
Buying/Rental Hotline: 13382150663 (mobile phone/WeChat)
Featrures
• Ultra-high precision 2D+3D AOI stop-and-go acquisition
• Climbing height and volume detection function
• Clear and reliable 3D quad light source digital stripe light
• Variable frequency 3D detection range height up to 30 mm
• Air-Free Intelligent Automatic Conveyor Conveyor System (IACS)
Specifications
| Optical System | |
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 4 Mpix or 12 Mpix (factory setting) |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 µm, 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase True Color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 4 Mpix@ 15 µm: 0-30 mm* |
| 12 Mpix@ 5.5 µm: 0-4 mm | |
| 12 Mpix@ 10 µm: 0-30 mm* | |
| *Need GPU card upgrade | |
| Inspection Performance | |
| Imaging Speed | 4 Mpix@ 15 µm: 21 cm²/sec |
| 12 Mpix@ 5.5 µm: 4.3 cm²/sec (2D only: 12.2 cm²/sec) | |
| 12 Mpix@ 10 µm: 14.5 cm²/sec | |
| 12 Mpix@ 10 µm: 23 cm²/sec with optional CoaXPress | |
| Note: Depending on component distribution | |
| Motion Table & Control | |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | Ballscrew + AC-servo controller |
| X-Y Axis Resolution | 1 μm |
| Board Handling | |
| Max PCB Size | TR7700QI @ 5.5 µm: 330 x 330 mm* |
| TR7700QI @ 10 µm, 15 µm: 510 x 460 mm | |
| TR7700QI DL @ 10 µm, 15 µm: 510 x 310 mm x 2 lanes, 510 x 590 mm x 1 lane | |
| *Depending on component distribution, the vailable PCB size could be different | |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 5.5 µm: 25 mm |
| 10 µm: 50 mm | |
| 15 µm: 40 mm | |
| Bottom Clearance | 40 mm [100 mm optional] |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline |
| Height: 880 – 920 mm | |
| * SMEMA Compatible | |
| Inspection Functions | |
| Component | Missing |
| Tombstoning | |
| Billboarding | |
| Polarity | |
| Rotation | |
| Shift | |
| Wrong Marking (OCV) | |
| Defective | |
| Upside Down | |
| Extra Component | |
| Foreign Material | |
| Lifted Component | |
| Solder | Solder Fillet Height |
| Solder Volume % | |
| Excess Solder | |
| Insufficient Solder | |
| Bridging | |
| Through-hole Pins | |
| Lifted Lead | |
| Golden Finger | |
| Scratch/Contamination | |
| Dimensions | |
| WxDxH | TR7700Q: 1000 x 1400 x 1650 mm |
| TR7700Q DL: 1000 x 15000 x 1650 mm | |
| Note: not including signal tower, signal tower height 520 mm | |
| Weight | TR7700Q: 650 kg |
| TR7700Q DL: 685 kg | |
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