The VIEWZOOM Ican series 3D SPI equipment focuses on solder paste inspection after printing, capable of accurately and efficiently analyzing various parameters including solder paste area, height, and volume. It can detect defects such as insufficient solder, excess solder, missing print, offset, abnormal angle, poor shape, bridging, board surface contamination, and foreign objects, while also ensuring BGA coplanarity and compliance. Through collaboration with printers and mounters, Ican improves product quality across the entire production line.

Compared with traditional SPI equipment, the Ican series leverages its advanced AI models to significantly improve inspection efficiency. The series can process massive amounts of image data and rapidly output inspection results in batches, greatly increasing inspection speed and shortening inspection time.

In addition, with the help of VIEWZOOM's self-built AI models and rich data analysis capabilities, the Ican series equipment can efficiently and accurately identify various mainstream defects. This technological advancement not only greatly improves product inspection efficiency, but also provides a solid foundation for achieving the goal of zero-defect products.