Venus 3D AOI

Suitable for the production needs of most production lines.

Changeover programming takes as little as 5 minutes, with switchable precision modes to meet diverse needs.
The entire Venus series can be optionally equipped with a 4D imaging solution + an 8-projector high-precision 3D imaging solution according to need.
This series' original 4D imaging solution easily achieves high-quality and efficient inspection results.

  • L:1400mm

  • W:1600mm

  • H:1600mm

  • PCB detectable size (mm):
    Same substrate: 50×50 ~ 810×320
    Maximum thickness: 6mm
    Same substrate: 50×50 to 810×590
    Maximum thickness: 6mm

True 3D algorithm
Excellent mechanical structure
Automatic MARK point recognition
4D oblique-view imaging
Save the full-board image
Superior inspection capability
True 3D Algorithms
No defect can escape 360° inspection
Mechanical Structure
Stable and excellent mechanical structure
Multi-Core Patents
Delivering reliable support for high-quality inspection
01
Inspection performance
Comprehensive inspection coverage for all types of components, breaking through inspection range limitations to achieve full inspection of 35mm components. The perfect integration of software and hardware solutions overcomes the challenge of board warpage.
02
One-click programming
Changeover programming takes as little as 5 minutes, with switchable precision modes to meet diverse needs. Excellent equipment consistency ensures inspection consistency.
03
4D imaging
The entire Venus series can be optionally equipped with a 4D imaging solution + an 8-projector high-precision 3D imaging solution according to need. This series' original 4D imaging solution easily achieves high-quality and efficient inspection results.
Venus
2D+3D+(4D)
Efficient and outstanding inspection performance
Comprehensive coverage of all types of components
The Venus 3D AOI can detect tiny components as small as metric 0201 (7µm) / metric 0603 (12µm). Based on independently developed 3D imaging technology, combined with mature and reliable traditional inspection algorithms as well as emerging artificial intelligence (AI) algorithms, Venus directly addresses the pain points of the current AOI inspection industry, delivering even more impressive inspection results!
2D+3D imaging comparison images of subtle defects
Breaking through inspection range limitations, achieving full inspection of components up to 35mm
Constrained by the current technical bottlenecks of 2D and 3D vision solutions, the industry generally faces the challenge of being unable to break through the effective measurement range. The Venus series adopts an innovative solution that successfully breaks through the limitations of the inspection range, easily achieving comprehensive 2D + 3D inspection of components up to 35mm in height.
High-component imaging analysis diagram
The perfect integration of software and hardware solutions overcomes the challenge of board warpage
After reflow soldering, board warpage and deformation pose challenges to the inspection stability of 3D AOI. Through targeted software and hardware design, Venus easily addresses this challenge and ensures consistent inspection results.
AI leads the way
AI-driven
Effortless programming and application
Changeover programming takes as little as 5 minutes
The entire Venus series features a built-in AI-driven intelligent programming system, enabling operators with zero programming experience to easily adjust and set parameters according to production schedules. Changeover programming can be completed in as little as 5 minutes, efficiently matching the pace of the production line.
Changeover process
High-speed mode: faster speed; High-precision mode: richer detail information
Switchable precision modes to meet diverse needs
To meet diverse precision and speed requirements, Venus can switch between different precision modes to improve inspection efficiency while ensuring inspection requirements are met, perfectly matching the production rhythm.
Excellent equipment consistency ensures inspection reliability
Built on excellent assembly craftsmanship and strict assembly requirements, the Venus series equipment is equipped with proprietary algorithms and functions that significantly reduce differences between machines. This enables the same algorithm program to be used across multiple machines, greatly enhancing the replicability and scalability of algorithm programs. Combined with a self-developed calibration system, Venus easily achieves consistent operation across all incoming equipment, ensuring a high degree of uniformity in all inspection standards and results.
Venus
4D (optional)
Imaging solution + 8-projector 3D imaging solution
In addition to the standard 13-projector (4-projector) imaging system, the entire series can be optionally equipped with an 8-projector high-precision 3D imaging solution, which detects various defects and achieves high-quality and efficient inspection results. Meanwhile, the 8-projector version of the 3D imaging solution is an upgrade of the standard 4-projector version, enabling higher precision and more perfect 3D reconstruction, easily handling situations with high requirements for 3D reconstruction, such as tall component occlusion and dense pins.
4D imaging defect analysis diagram
Venus Inspection Examples
Performance parameters
Venus Specifications
Model Venus 360 Venus 510 Venus 810 Venus 510D Venus 810D Venus 2000
Dimensions
(L × W × H mm)
950*1250*1600 1100*1450*1600 1400*1600*1600 1100*1600*1600 1400*1600*1600 2800*1460*1600
Machine Weight 950kg 1100kg 1400kg 1250kg 1450kg 2200kg
Power Rated power: 500W, Maximum power: 800W Rated power: 600W, Maximum power: 850W Rated power: 800W, Maximum power: 1.2kW
Air supply 0.5MPa 5L/min 0.5MPa 10L/min
Conveyor Single-lane conveyor (front rail L1 fixed, rear rail L2 auto-adjustable), three-stage board stopping (automatically switches to single-stage board stopping when PCB length > 230mm) Dual-lane conveyor (front rail L1 fixed, L2 & L3 & L4 auto-adjustable), three-stage board stopping (automatically switches to single-stage board stopping when PCB length > 230mm) Single-lane conveyor (front rail L1 fixed, rear rail L2 auto-adjustable), three-stage board stopping (automatically switches to single-stage board stopping when PCB length > 850mm)
PCB Specifications
(L×Wmm, Maximum Thickness)
50*50~360*320
Maximum thickness: 6mm
50*50~510*510
Maximum thickness: 6mm
50*50~810*690
Maximum thickness: 6mm
Same substrate:
50*50~510*320
Maximum thickness: 6mm
Same substrate:
50*50~810*320
Maximum thickness: 6mm
50*50~2050*510
Maximum thickness: 10mm
Same substrate:
50*50~510*590
Maximum thickness: 6mm
Same substrate:
50*50~810*590
Maximum thickness: 6mm
Camera / Resolution
IFOV / Speed
Standard: 12MP 12µm (compatible with Venus 360/510/810)
Standard: 12MP 15µm (compatible with Venus 510D/810D/2000)
Standard: 12MP 7µm
Optional: 21MP 10µm
Optional: 21MP 7µm
FOV:48.6*36.4mm
FOV: 60.9*45.7mm
FOV:32.4*24.3mm
FOV:51.2*40.9mm
FOV: 33.3*26.6mm
Speed:450ms/FOV
Speed:450ms/FOV
Speed:450ms/FOV
Speed:450ms/FOV
Speed:450ms/FOV
PCB Direction Left to right, right to left, left to left, right to right (freely configurable in the program)
Options Repair workstation, MES interface, offline programming, centralized judgment system, SPC statistical analysis, ring 8-projector, 7µm lens option, 4 side-view cameras, automatic line changeover, coplanarity & collinearity inspection, automatic labeling system
Venus Series Common Specifications
Side camera 20MP × 4 (optional) Number of 3D projectors 4; 8 (optional) Light Source RGB ring light + coaxial light + white light
Maximum detectable component height Standard: 20mm (up to 35mm with Z-axis head lift) Minimum detectable component Metric 0603 (standard 12µm/15µm) / Metric 0201 (optional 7µm)
Maximum board passage height Top 50mm, Bottom 50mm Maximum board warpage correction ±5mm Rail height above floor 900±50 mm
Power Supply 200-240V AC 50/60HZ Operating System Window 10
Venus Series Parameters
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